Emitter assembly with a redistribution layer for a vertical cavity surface emitting laser (vcsel) chip

An emitter assembly, comprising:

• a vertical cavity surface emitting laser (VCSEL) chip comprising a plurality of VCSELs,
• wherein the plurality of VCSELs are respectively associated with a plurality of first electrical contacts, and
• wherein a first spacing of the plurality of first electrical contacts defines a first pitch;
• a redistribution layer, disposed on the VCSEL chip, to increase the first pitch of the plurality of first electrical contacts;
• a carrier having a plurality of second electrical contacts,
• wherein a second spacing of the plurality of second electrical contacts defines a second pitch greater than the first pitch;
• and
• a plurality of conductive pillars that electrically connect the plurality of first electrical contacts and the plurality of second electrical contacts via the redistribution layer,
• wherein the plurality of conductive pillars are arranged according to the second spacing that defines the second pitch.

A method, comprising:

• assembling a vertical cavity surface emitting laser (VCSEL) chip in a flip chip configuration with a carrier to produce an emitter assembly,
• wherein the VCSEL chip comprises a plurality of first electrical contacts for a plurality of VCSELs of the VCSEL chip, and a first spacing of the plurality of first electrical contacts defines a first pitch,
• wherein the carrier comprises a plurality of second electrical contacts, and a second spacing of the plurality of second electrical contacts defines a second pitch greater than the first pitch, and
• wherein a redistribution layer to increase the first pitch of the plurality of first electrical contacts is disposed on the VCSEL chip, the redistribution layer being configured to electrically connect the plurality of first electrical contacts and the plurality of second electrical contacts via a plurality of conductive pillars arranged according to the second spacing that defines the second pitch;
• and
• performing a solder reflow procedure on the emitter assembly.