Connector module with improved heat dissipation performance

A connector module, comprising:

• a bracket comprising a first bracket and a second bracket;
• the first bracket comprising a plurality of side walls and an opening surrounded by the plurality of side walls;
• the plurality of side walls comprising a first side wall, a second side wall opposite to the first side wall, a third side wall connecting one end of the first side wall and one end of the second side wall, and a fourth side wall connecting another end of the first side wall and another end of the second side wall;
• each of the first side wall, the second side wall, the third side wall and the fourth side wall being provided with a plurality of receiving grooves;
• the second bracket being of a frame-shaped configuration, and the second bracket comprising a central opening extending through the second bracket along a vertical direction and a plurality of heat dissipation channels extending along horizontal directions;
• and
• a plurality of cable connectors correspondingly accommodated in the receiving grooves;
• each cable connector comprising a body, a plurality of conductive terminals and a plurality of cables connected to the plurality of conductive terminals, each body being at least partially accommodated in a corresponding receiving groove, the plurality of conductive terminals being configured to engage with a plurality of conductive elements of a circuit board;
• the circuit board being at least partially clamped between the first bracket and the second bracket;
• the circuit board being configured to mount a chip which is exposed in the opening;
• the central opening corresponds to the chip along the vertical direction.