Led display panel and manufacturing method thereof
AssigneeTcl China Star Optoelectronics Technology Co., Ltd.
InventorZeke Zheng
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Abstract
A light-emitting diode (LED) display panel and a manufacturing method thereof are provided. The LED display panel includes a substrate, an LED array, and conductive members. The LED array includes a plurality of LED chips disposed on the substrate in an array. The conductive members are disposed between the LED chips and the substrate. The LED chips are fixed onto and electrically connected to the substrate by the conductive members, and the conductive members have adhesion, and the adhesion is adjustable.
Claims20
A light-emitting diode (LED) display panel, comprising:
- a substrate;
- an LED array comprising a plurality of LED chips disposed on the substrate in an array;
- and
- a plurality of conductive members disposed between the LED chips and the substrate, wherein the LED chips are fixed onto and electrically connected to the substrate by the conductive members, the conductive members comprise a photocuring conductive adhesive, and the photocuring conductive adhesive is changed from a liquid state to a solid state under a visible light condition;
- wherein the conductive members have adhesion, and the adhesion is adjustable.
A light-emitting diode (LED) display panel, comprising:
- a substrate;
- an LED array comprising a plurality of LED chips disposed on the substrate in an array;
- and
- a plurality of conductive members disposed between the LED chips and the substrate, wherein the LED chips are fixed onto and electrically connected to the substrate by the conductive members;
- wherein the conductive members have adhesion, and the adhesion is adjustable.
A manufacturing method of a light-emitting diode (LED) display panel, comprising following steps:
- providing a substrate and a plurality of LED chips;
- disposing conductive members having adjustable adhesion on the substrate or the LED chips;
- transferring the LED chips onto the substrate and electrically connecting the LED chips to the substrate by the conductive members;
- and
- powering the LED chips and adjusting adhesion of corresponding conductive members according to a light-emitting state of the LED chips.
Dependencies are inferred from the claim text.