Shape-shifting, optical-electrical adjustment and protection stretch-seal structure design
AssigneeGeneral Interface Solution Limited
InventorsCHIA-MING FAN, WEN-YOU LAI, HSIEN-YING CHOU, PO-LUN CHEN, CHUN-TA CHEN, PO-CHING LIN
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Abstract
A micro light-emitting diode display is based on a conventional micro light-emitting diode display and includes at least one electrically conductive material layer or at least one functional material added to an encapsulation layer, so as to achieve antistatic effect. The micro light-emitting diode display solves the problem that the conventional micro light-emitting diode display is easily damaged by electrostatic breakdown.
Claims20
A micro light-emitting diode display, comprising a support layer, an optical adhesive layer, a flexible substrate, a flexible thin film transistor array module, and an encapsulation layer;
- the optical adhesive layer being disposed on an upper surface of the support layer, the flexible substrate being disposed on an upper surface of the optical adhesive layer, the flexible thin film transistor array module being disposed on an upper surface of the flexible substrate, the encapsulation layer covering an upper surface of the flexible thin film transistor array module, characterized in that:
- the micro light-emitting diode display further comprises at least one electrically conductive material layer disposed on one side away from the flexible thin film transistor array module.
A micro light-emitting diode display, comprising a support layer, an optical adhesive layer, a flexible substrate, a flexible thin film transistor array module, and an encapsulation layer;
- the optical adhesive layer being disposed on an upper surface of the support layer, the flexible substrate being disposed on an upper surface of the optical adhesive layer, the flexible thin film transistor array module being disposed on an upper surface of the flexible substrate, the encapsulation layer covering an upper surface of the flexible thin film transistor array module, characterized in that:
- the encapsulation layer includes an encapsulation material and at least one functional material, wherein the functional material is an electrically conductive material, an antistatic material, a high dielectric material or a combination thereof.
Dependencies are inferred from the claim text.