US 2024/0194718 A1 · SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE INCLUDING COUPLING STRUCTURES FOR ELECTRICALLY INTERCONNECTING STACKED SEMICONDUCTOR SUBSTRATES

Abstract

To provide a solid-state imaging device and an electronic apparatus with further improved performance. A solid-state imaging device including: a first substrate on which a pixel unit is formed, and a first semiconductor substrate and a first multi-layered wiring layer are stacked; a second substrate on which a circuit having a predetermined function is formed, and a second semiconductor substrate and a second multi-layered wiring layer are stacked; and a third substrate on which a circuit having a predetermined function is formed, and a third semiconductor substrate and a third multi-layered wiring layer are stacked. The first substrate, the second substrate, and the third substrate are stacked in this order. The pixel unit has pixels arranged thereon. The first substrate and the second substrate are bonded together in a manner that the first multi-layered wiring layer and the second semiconductor substrate are opposed to each other. A first coupling structure for electrically coupling a circuit of the first substrate and the circuit of the second substrate to each other does not include a coupling structure formed from the first substrate as a base over bonding surfaces of the first substrate and the second substrate. Alternatively, the first coupling structure does not exist.

Claims20

Dependent claims

A light detecting device, comprising:

a first substrate that includes:
a first semiconductor substrate;
and
a first multi-layered wiring layer on the first semiconductor substrate;
a second substrate that includes:
a second semiconductor substrate;
and
a second multi-layered wiring layer on the second semiconductor substrate;
a third substrate that includes:
a third semiconductor substrate;
and
a third multi-layered wiring layer on the third semiconductor substrate, wherein
the first substrate, the second substrate, and the third substrate are stacked in this order,
the second substrate is bonded to the third substrate, and
the second multi-layered wiring layer is opposite to the third multi-layered wiring layer;
a first coupling structure configured to electrically couple a first wiring line in the second multi-layered wiring layer and a second wiring line in the third multi-layered wiring layer, wherein the first coupling structure includes a via that penetrates one of the second substrate or the third substrate;
and
a second coupling structure on a bonding surface of each of the second substrate and the third substrate, wherein the second coupling structure includes an electrode junction structure in which electrodes on the bonding surface of the second substrate is joined in direct contact with electrodes on the bonding surface of the third substrate.

15 more elements

A light detecting device, comprising:

a first substrate that includes:
a first semiconductor substrate;
and
a first multi-layered wiring layer on the first semiconductor substrate;
a second substrate that includes:
a second semiconductor substrate;
and
a second multi-layered wiring layer on the second semiconductor substrate;
a third substrate that includes:
a third semiconductor substrate;
and
a third multi-layered wiring layer on the third semiconductor substrate, wherein the first substrate, the second substrate, and the third substrate are stacked in this order;
and
a first coupling structure that includes:
a pad on a back surface of the first substrate, wherein the pad is configured to function as an I/O unit;
a first opening from a back surface side of the first substrate, wherein the first opening is configured to expose a first wiring line in the first multi-layered wiring layer;
and
an electrically-conductive material layer on an inner wall of the first opening, wherein the first wiring line exposed by the first opening is electrically coupled to the pad by the electrically-conductive material layer.

15 more elements

Dependencies are inferred from the claim text.

Solid-state imaging device and electronic device including coupling structures for electrically interconnecting stacked semiconductor substrates

Life of this patent

Solid-state imaging device and electronic device including coupling structures for electrically interconnecting stacked semiconductor substrates

Life of this patent

Abstract

Claims20