Slanted glass edge for image sensor package
AssigneeStmicroelectronics Pte Ltd
InventorsLaurent HERARD, David GANI
Life of this patent
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Abstract
Disclosed herein is a method of reducing noise captured by an image sensor. The method includes affixing a bottom surface of a glass covering to the image sensor, permitting light to impinge upon the glass covering, and shaping the glass covering such that when the light that impinges upon the glass covering impinges upon a sidewall of the glass covering, the sidewall reflects the light on a trajectory away from the image sensor.
Claims17
A method of reducing noise captured by an image sensor, the method comprising:
- forming a glass covering;
- affixing a bottom surface of the glass covering to the image sensor;
- permitting light to impinge upon the glass covering;
- and
- wherein the forming of the glass covering comprises shaping the glass covering such that when the light that impinges upon the glass covering impinges upon a sidewall of the glass covering, the sidewall reflects the light on a trajectory away from the image sensor.
A method of assembling a digital image sensor package, comprising:
- positioning an image sensor substrate on a printed circuit board (PCB);
- and
- associating a transparent covering with the image sensor substrate, the transparent covering having a bottom surface, a top surface opposite to the bottom surface, and a sidewall that delimits a perimeter edge of the transparent covering, such that the transparent covering overlies the image sensor substrate;
- wherein the associating of the transparent covering with the image sensor substrate includes forming a first angle between the sidewall and the top surface of the transparent covering, and a second angle between the sidewall and the bottom surface of the transparent covering, where the second angle is different from the first angle, such that light entering the transparent covering on a first trajectory and impinging upon the sidewall is reflected on a second trajectory that avoids the image sensor substrate, thereby reducing noise in captured images.
A method of forming a digital image sensor package, the method comprising:
- disposing an image sensor substrate on a printed circuit board (PCB), wherein photodiodes are formed on the image sensor substrate;
- and
- forming a glass covering to have a top surface with a greater surface area than a bottom surface of the glass covering, a bottom surface, and a sidewall delimiting a perimeter edge of the glass covering, the sidewall forming an obtuse angle with the bottom surface and an acute angle with the top surface such that the sidewall is angled with respect to normal to direct incoming light along a trajectory that avoids the photodiodes.
Dependencies are inferred from the claim text.