Semiconductor device

Abstract

Reliability is improved in a semiconductor device using a heat conductive member. The semiconductor device includes a first semiconductor chip, a heat dissipation member, a heat conductive member, and an outflow prevention part. In a semiconductor package including the first semiconductor chip, the heat dissipation member, the heat conductive member, and the outflow prevention part, the heat conductive member is disposed between the heat dissipation member and the chip plane of the first semiconductor chip. The outflow prevention part prevents the outflow of the heat conductive member from the chip plane of the first semiconductor chip.

Dependencies are inferred from the claim text.