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AssigneeBoe Technology Group Co., Ltd.
InventorsGuoying Wang, Pan Xu, Dacheng Zhang, Xing Zhang, Ying Han, Chengyuan Luo, Zhen Song
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An array substrate having a connection pad in a connection pad area is provided. The connection pad includes a plurality of first probe contact pads, a plurality of second probe contact pads, a plurality of first connection lines coupled to the plurality of first probe contact pads, respectively, and a plurality of second connection lines coupled to the plurality of second probe contact pads, respectively; the plurality of first connection lines and the plurality of second connection lines being in two different layers. A total number of conductive layers electrically connected to a respective first connection line of the plurality of first connection lines is different from a total number of conductive layers electrically connected to a respective second connection line of the plurality of second connection lines.
An array substrate, comprising a connection pad in a connection pad area;
(canceled)
A connection pad, comprising a plurality of first probe contact pads, a plurality of second probe contact pads, a plurality of first connection lines coupled to the plurality of first probe contact pads, respectively, and a plurality of second connection lines coupled to the plurality of second probe contact pads, respectively;
Dependencies are inferred from the claim text.