Power cell for semiconductor devices
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChung-Chieh YANG, Chung-Ting LU, Yung-Chow PENG
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Abstract
A device includes an electrical circuit. The device further includes a first conductive pillar over a first side of a substrate. The device further includes a first conductive rail electrically connected to the first conductive pillar, wherein the electrical circuit is electrically connected to the first conductive rail by the first conductive pillar. The device further includes a power pillar extending through the substrate, wherein the power pillar is electrically connected to the first conductive rail.
Claims20
A device, comprising:
- an electrical circuit;
- a first conductive pillar over a first side of a substrate;
- a first conductive rail electrically connected to the first conductive pillar, wherein the electrical circuit is electrically connected to the first conductive rail by the first conductive pillar;
- and
- a power pillar extending through the substrate, wherein the power pillar is electrically connected to the first conductive rail.
A device, comprising:
- an electrical circuit on a first side of a substrate;
- a first conductive rail on the first side of the substrate;
- a power pillar extending through the substrate from the first side of the substrate to a second side of the substrate opposite the first side of the substrate;
- and
- a second conductive rail on the second side of the substrate, wherein the second conductive rail is electrically connected to the electrical circuit through the first conductive rail.
A method comprising:
- forming an electrical circuit on a first side of a substrate;
- forming a first conductive rail on the first side of the substrate;
- electrically connecting the first conductive rail and the electrical circuit;
- forming a second conductive rail on a second side of the substrate opposite the first side of the substrate;
- forming a power pillar electrically connecting the first conductive rail and the second conductive rail, wherein forming the power pillar comprises forming a through substrate via (TSV) extending through the substrate.
Dependencies are inferred from the claim text.