Semiconductor apparatus and method for manufacturing semiconductor apparatus

Abstract

Semiconductor device includes first lead, second lead, light-emitting element, light-receiving element, transparent resin and first resin. First lead includes first die pad having first obverse surface and first reverse surface mutually opposite in thickness direction. Second lead includes second die pad having second obverse surface facing same side as first obverse surface in thickness direction and second reverse surface facing same side as first reverse surface in thickness direction. Light-emitting element is mounted on first obverse surface. Light-receiving element is mounted on second obverse surface. Transparent resin covers portions of light-emitting element and light-receiving element. First resin covers transparent resin. Transparent resin includes transparent-resin obverse surface facing same side as first obverse surface in thickness direction, and transparent-resin reverse surface facing same side as first reverse surface in thickness direction. Transparent-resin reverse surface has surface roughness larger than that of transparent-resin obverse surface.

Dependencies are inferred from the claim text.