Integrated photonic device and electronic device architectures
AssigneeIntel Corporation
InventorsSuddhasattwa Nad, Brandon Marin, Jeremy Ecton, Gang Duan, Srinivas Pietambaram
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Abstract
Apparatuses, systems, assemblies, and techniques related to integrating photonics integrated circuit devices and electronic integrated circuit devices into an assembly or module are described. An integrated module includes a photonics integrated circuit device within an opening of a glass core substrate and an electronic integrated circuit device direct bonded to the photonics integrated circuit device. An optical waveguide is within or on the glass core substrate and has a terminal end edge coupled to the photonics integrated circuit device within the opening.
Claims20
An apparatus, comprising:
- a photonic integrated circuit (PIC) device within an opening in a glass core substrate, the PIC device comprising a plurality of first metal bond pads over a surface of the PIC device;
- an electronic integrated circuit (EIC) device comprising a plurality of second metal bond pads over a surface of the EIC device, wherein the first metal bond pads are directly bonded to corresponding ones of the second metal bond pads;
- and
- an optical waveguide on or within the glass core substrate, the optical waveguide comprising a terminal end edge coupled to the PIC device within the opening.
A system, comprising:
- a system substrate;
- and
- an electro-optical module coupled to the system substrate, the electro-optical module comprising:
- a photonic integrated circuit (PIC) device within an opening in a glass core substrate, the PIC device directly connected to the EIC device by interconnects therebetween;
- and
- an optical waveguide on or within the glass core substrate, the optical waveguide comprising a terminal end edge coupled to the PIC device within the opening.
A method, comprising:
- mounting a glass core substrate to a carrier substrate, the glass core substrate comprising an opening therein and the glass core substrate comprising optical waveguide on or within the glass core substrate and having a terminal end adjacent the opening;
- direct bonding an electronic integrated circuit (EIC) device to a photonic integrated circuit (PIC) device, the direct bonding coupling a plurality of first metal bond pads over a surface of the PIC device directly to corresponding ones of a plurality of second metal bond pads over a surface of the EIC device;
- and
- placing the PIC device within the opening;
- forming an encapsulation material over the EIC device and the glass core substrate;
- and
- removing the glass core substrate from the carrier substrate.
Dependencies are inferred from the claim text.