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US 2024/0194652 A1Published application
Light emitting device and manufacturing method thereof
AssigneeAUO Corporation
InventorsHao-Lun Hsieh, Shuo-Yang Sun, Fu-Yang Chen, Xiao-Yun Li, Yu-Hao Chang, Jhih-Jhu Jhan
Life of this patent
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Abstract
A light emitting device includes a light emitting diode package structure. The light emitting diode package structure includes a circuit structure, a plurality of light emitting diodes, and an encapsulation layer. The light emitting diodes are disposed on the circuit structure and electrically connected to the circuit structure. The encapsulation layer covers top surfaces and side surfaces of the light emitting diodes and a side surface of the circuit structure.
Claims19
A light emitting device, comprising:
- a light emitting diode package structure, comprising:
- a circuit structure;
- a plurality of light emitting diodes disposed on the circuit structure and electrically connected to the circuit structure;
- and
- an encapsulation layer covering top surfaces and side surfaces of the light emitting diodes and a side surface of the circuit structure.
2 more elements
A manufacturing method of a light emitting device, comprising:
- providing a plurality of circuit structures separated from each other and a plurality of light emitting diodes located on the circuit structures on a carrier board;
- forming an encapsulation material on the light emitting diodes and the circuit structures, wherein the encapsulation material covers top surfaces and side surfaces of the light emitting diodes and side surfaces of the circuit structures;
- and
- cutting the encapsulation material along a plurality of cutting lines to form a plurality of encapsulation layers separated from each other, and forming a plurality of light emitting diode package structures, wherein each of the light emitting diode package structures comprises a corresponding circuit structure, a plurality of corresponding light emitting diodes, and a corresponding encapsulation layer, and wherein the cutting lines are located between the circuit structures.
1 more element
Dependencies are inferred from the claim text.