Multi-wafer integration
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChin-Min Lin, Hung-Jen Hsu, Dun-Nian Yaung
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Abstract
Semiconductor devices and methods of forming the same are provided. A method according to the present disclosure includes forming a first wafer including a plurality of electronic integrated circuits (EICs), forming a second wafer including a plurality of photonic integrated circuits (PICs), bonding the first wafer to the second wafer to form a first stacked wafer. The bonding of the first wafer to the second wafer includes vertically aligning each of the plurality of the EICs with one of the plurality of the PICs.
Claims20
A semiconductor device, comprising:
- a first substrate comprising one high-performance computing integrated circuit (HPC IC);
- a second substrate comprising a plurality of electronic ICs (EICs) and bonded directly to the first substrate;
- and
- a third substrate comprising a plurality of photonic integrated circuits (PICs) and bonded directly to the second substrate,
- wherein no underfill material is present between the first substrate and the second substrate and between the second substrate and the third substrate.
A semiconductor device, comprising:
- a base substrate;
- a first substrate comprising a plurality of photonic integrated circuits (PICs) and bonded directly to the base substrate;
- a second substrate comprising a plurality of electronic ICs (EICs) and bonded directly to the first substrate;
- a third substrate comprising one high-performance computing integrated circuit (HPC IC) and bonded directly to the second substrate;
- and
- an optical signal opening extending through the third substrate, the second substrate, and partially into the first substrate.
A device structure, comprising:
- a first substrate comprising one high-performance computing integrated circuit (HPC IC);
- a second substrate comprising a plurality of electronic ICs (EICs) and bonded directly to the first substrate;
- and
- a third substrate comprising a plurality of photonic integrated circuits (PICs) and bonded directly to the second substrate,
- wherein each of the plurality of PICs comprises an optical signal opening that extends partially into each of the plurality of PICs.
Dependencies are inferred from the claim text.