Semiconductor package

A semiconductor package comprising:

• a substrate including a top surface, a plurality of first conductive pads and a plurality of second conductive pads, the plurality of first and second conductive pads are located on the top surface;
• a plurality of first bumps, one end of each of the plurality of first bumps is connected to one of the plurality of first conductive pads;
• a first chip connected to the other end of each of the plurality of first bumps;
• a plurality of metal pillars, one end of each of the plurality of metal pillars is connected to one of the plurality of second conductive pads;
• a plurality of second bumps, one end of each of the plurality of second bumps is connected to the other end of one of the plurality of metal pillars, wherein a cross-sectional area of each of the plurality of metal pillars is larger than a cross-sectional area of each of the plurality of second bumps;
• and
• a second chip connected to the other end of each of the plurality of second bumps and located above the first chip.