Vertically mounted die groups

A multi-die structure, comprising:

• a base substrate structure having a top surface;
• and
• a plurality of die groups disposed on the top surface of the based substrate structure, the plurality of die groups comprising:
• a first die group comprising a plurality of first dies stacked parallel to each other and parallel to a front surface of the first die group, wherein the front surface of the first die group and the top surface of the base substrate structure intersect at a first edge, and the first edge extends in a first direction in the top surface of the base substrate structure;
• and
• a second die group comprising a plurality of second dies stacked parallel to each other and parallel to a front surface of the second die group, wherein the front surface of the second die group and the top surface of the base substrate structure intersect at a second edge, the second edge extends in a second direction in the top surface of the base substrate structure;
• and
• wherein the second die group is a neighboring die group of the first die group, and the first direction is not parallel to the second direction.

A semiconductor package, comprising:

• a base substrate structure having a top surface;
• and
• a plurality of die groups disposed on the top surface of the based substrate structure, the plurality of die groups comprising:
• a first die group comprising a plurality of first dies stacked parallel to each other and parallel to a front surface of the first die group, wherein the front surface of the first die group and the top surface of the base substrate structure intersect at a first edge, and the first edge extends in a first direction in the top surface of the base substrate structure;
• a second die group comprising a plurality of second dies stacked parallel to each other and parallel to a front surface of the second die group, wherein the front surface of the second die group and the top surface of the base substrate structure intersect at a second edge, the second edge extends in a second direction in the top surface of the base substrate structure;
• a third die group comprising a plurality of third dies stacked parallel to each other and parallel to a front surface of the third die group, the front surface of the third die group and the top surface of the base substrate structure intersect at a third edge, and the third edge extends in a third direction in the top surface of the base substrate structure;
• and
• a fourth die group includes a plurality of fourth dies stacked parallel to each other and parallel to a front surface of the fourth die group, the front surface of the fourth die group and the top surface of the base substrate structure intersect at a fourth edge, and the fourth edge extends in a fourth direction in the top surface of the base substrate structure;
• and
• wherein the first die group and the second die group are disposed in a first row, the third die group and the fourth die group are disposed in a second row, the first die group and the third die group are disposed in a first column, and the second die group and the fourth die group are disposed in a second column;
• and
• wherein the second die group is a neighboring die group of the first die group, and the first direction is not parallel to the second direction.