Semiconductor package and method of fabricating the same

A semiconductor package, comprising:

• a substrate;
• a chip stack on the substrate;
• a first semiconductor chip on the substrate and spaced apart from the chip stack;
• a bridge chip interposed between and electrically connecting the chip stack and the first semiconductor chip;
• and
• a molding layer on the substrate and surrounding the chip stack, the first semiconductor chip, and the bridge chip,
• wherein the chip stack includes a plurality of second semiconductor chips that are stacked on the substrate,
• wherein the bridge chip is in direct contact with the first semiconductor chip and the second semiconductor chips, and
• wherein a lowermost end of the bridge chip is at a level higher than a level of a top surface of the substrate.

A semiconductor package, comprising:

• a substrate;
• a first semiconductor chip on the substrate, the first semiconductor chip including,
• a first circuit layer on a bottom surface of the first semiconductor chip and having a first integrated circuit of the first semiconductor chip, and
• a first lateral wiring layer on a first lateral surface of the first semiconductor chip and connected to the first circuit layer;
• a second semiconductor chip on the substrate, the second semiconductor chip including,
• a second circuit layer on a bottom surface of the second semiconductor chip and having a second integrated circuit of the second semiconductor chip, and
• a second lateral wiring layer on a second lateral surface of the second semiconductor chip and connected to the second circuit layer;
• a bridge chip including a first primary surface and a second primary surface, the first primary surface bonded to the first lateral wiring layer, the second primary surface bonded to the second lateral wiring layer;
• and
• a molding layer on the substrate and surrounding the first semiconductor chip, the second semiconductor chip, and the bridge chip,
• wherein the first semiconductor chip and the second semiconductor chip are electrically connected through the bridge chip.