Wafer bonding apparatus and method

An apparatus for wafer bonding, comprising:

• a first bearing table, configured to hold a first wafer, wherein the first wafer is provided with at least one first alignment mark;
• a second bearing table, opposite to the first bearing table, and configured to hold a second wafer, wherein the second wafer is provided with at least one second alignment mark;
• an alignment component, located on at least a side of the first bearing table or a side of the second bearing table, and configured to determine a first position parameter of the first alignment mark on the first wafer by using an optical beam and determine a second position parameter of the second alignment mark on the second wafer with the optical beam;
• a mobile component, connected to the first bearing table and the second bearing table, and configured to adjust, according to the first position parameter and the second position parameter, a relative position between the first wafer and the second wafer until a relative position between the first alignment mark and the second alignment mark satisfies a predetermined bonding condition;
• and
• a bonding component, connected to the first bearing table and the second bearing table, and configured to bond the first wafer to the second wafer.