Integrated process sequence for hybrid bonding applications

A method for sequencing a hybrid bonding process, comprising:

• selecting at least one source of dies for bonding;
• selecting a target on which dies will be bonded;
• linking the at least one source to the target;
• linking the target to the at least one source;
• forming an integrated bonding product sequence that includes at least one first linked bonding sequence for the at least one source and a second linked bonding sequence for the target;
• determining bonding process chamber allocations and process timing for the at least one source and the target based on the integrated bonding product sequence;
• comparing the integrated bonding product sequence with a user supplied bonding sequence;
• determining differences between the integrated bonding product sequence and the user supplied bonding sequence;
• and
• notifying the user of the differences and compatibility with a hybrid bonding tool.

A non-transitory, computer readable medium having instructions stored thereon that, when executed, cause a method for sequencing a hybrid bonding process to be performed, the method comprising:

• selecting at least one source of dies for bonding;
• selecting a target on which dies will be bonded;
• linking the at least one source to the target;
• linking the target to the at least one source;
• forming an integrated bonding product sequence that includes at least one first linked bonding sequence for the at least one source and a second linked bonding sequence for the target;
• determining bonding process chamber allocations and process timing for the at least one source and the target based on the integrated bonding product sequence;
• and
• bonding at least one die from the at least one source to the target using the integrated bonding product sequence.