Semiconductor Device and Method of Making a Semiconductor Package with Graphene for Die Attach
AssigneeSTATS ChipPAC Pte. Ltd.
InventorsYongMoo Shin, HeeSoo Lee, SuJeong Kwon
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Abstract
A semiconductor device has a substrate with a die pad. A conductive material is disposed on the die pad. The conductive material includes a plurality of graphene-coated metal balls in a matrix. A semiconductor die is disposed on the conductive material. The conductive material is sintered using an infrared laser. A bond wire is formed between the semiconductor die and substrate. An encapsulant is deposited over the semiconductor die and bond wire.
Claims25
A method of making a semiconductor device, comprising:
- providing a substrate including a die pad;
- disposing a conductive material on the die pad, wherein the conductive material includes a plurality of graphene-coated metal balls in a matrix;
- disposing a semiconductor die on the conductive material;
- sintering the conductive material using an infrared laser;
- forming a bond wire between the semiconductor die and substrate;
- and
- depositing an encapsulant over the semiconductor die and bond wire.
A method of making a semiconductor device, comprising:
- providing a substrate;
- disposing a conductive material over the substrate, wherein the conductive material includes graphene;
- and
- disposing a semiconductor die over the conductive material.
A semiconductor device, comprising:
- a substrate including a die pad;
- a conductive material disposed on the die pad, wherein the conductive material includes a plurality of graphene-coated metal balls;
- a semiconductor die disposed on the conductive material;
- a bond wire formed between the semiconductor die and substrate;
- and
- an encapsulant deposited over the semiconductor die and bond wire.
A semiconductor device, comprising:
- a substrate;
- a conductive material disposed over the substrate, wherein the conductive material includes graphene;
- and
- a semiconductor die disposed over the conductive material.
Dependencies are inferred from the claim text.