Back to results
US 2024/0194627 A1Published application
Semiconductor devices including seed structure and method of manufacturing the semiconductor devices
AssigneeSamsung Electronics Co., Ltd.
InventorSeungmin Baek
Life of this patent
Estimating the term…
Abstract
A semiconductor device may include a seed structure on a complex structure. The seed structure may include a first barrier layer, a first seed layer on the first barrier layer, a second barrier layer on the first seed layer, and a second seed layer on the second barrier layer. The second barrier layer may contact a side surface of at least one of the first barrier layer and the first seed layer. An electrode layer may be disposed on the seed structure.
Claims21
1-24. (canceled)
A semiconductor device comprising:
- a package structure;
- a seed structure on the package structure, the seed structure includes
- a first barrier layer,
- a first seed layer on the first barrier layer,
- a second barrier layer on the first seed layer,
- a second seed layer on the second barrier layer,
- a third barrier layer on the second seed layer, the third barrier layer contacts a top surface and a side surface of the second seed layer, and the third barrier layer contacts a side surface of the second barrier layer, and
- a third seed layer on the third barrier layer;
- and
- an electrode layer on the seed structure.
7 more elements
A semiconductor device comprising:
- a semiconductor chip including a plurality of chip pads;
- an encapsulant on the semiconductor chip;
- at least one redistribution layer on the encapsulant and the semiconductor chip;
- and
- a solder ball on the at least one redistribution layer, the solder ball is connected to one corresponding chip pad of the plurality of chip pads via the at least one redistribution layer, wherein
- the at least one redistribution layer includes
- a seed structure on the encapsulant, the seed structure includes
- a first barrier layer,
- a first seed layer on the first barrier layer,
- a second barrier layer on the first seed layer, and
- a second seed layer on the second barrier layer, the second barrier layer contacts a top surface of the first seed layer and a side surface of the first barrier layer and the first seed layer, and
- an electrode on the seed structure.
9 more elements
Dependencies are inferred from the claim text.