Semiconductor package

A semiconductor package comprising:

• a redistribution layer;
• a semiconductor chip provided on the redistribution layer and having a first surface and a second surface opposite to the first surface, the semiconductor chip including a first chip pad and a second chip pad which are exposed at the first surface;
• a capacitor chip disposed between the first surface and the redistribution layer and extended across the first surface from a first sidewall of the semiconductor chip to a second sidewall of the semiconductor chip, the capacitor chip including
• a through hole extending through the capacitor chip, and
• a capacitor chip pad in direct physical contact with the first chip pad;
• an insulating layer covering the first surface and the capacitor chip;
• and
• a through structure extending through the through hole and being in direct physical contact with the second chip pad and connected to the redistribution layer.

A semiconductor package comprising:

• a redistribution layer;
• a first semiconductor chip provided on the redistribution layer and having a first surface and a second surface opposite to the first surface, the first semiconductor chip including a first chip pad and a second chip pad which are exposed at the first surface;
• a capacitor chip covering the first surface and disposed between the first surface and the redistribution layer, the capacitor chip including a capacitor chip pad connected to the first chip pad;
• and
• a through-structure penetrating the capacitor chip and connecting the second chip pad to the redistribution layer,
• wherein a sidewall of the capacitor chip is vertically aligned with a sidewall of the first semiconductor chip.