Metallized semiconductor die and manufacturing method

A semiconductor die comprising:

• a base body comprising:
• a semiconductor material;
• and
• a surface with two contact areas having contact pads at which the semiconductor die is electrically contactable and two metal caps arranged directly at the contact pads.

A method for manufacturing a semiconductor die, the method comprising:

• providing the semiconductor die including a base body comprising a semiconductor material and a surface with two contact areas having contact pads at which the semiconductor die is electrically contactable;
• applying a passivation layer for electrical passivation to the surface of the semiconductor die thereby providing areas free of passivation allowing external access to each contact pad;
• and
• metallizing parts of the surface of the semiconductor die with metal caps, the metal caps directly contacting the contact pads.