Solid state drive apparatus and data storage apparatus including the same

A solid state drive (SSD) apparatus comprising:

• a case including an upper wall and a lower wall;
• a substrate in the case, the substrate including a first surface facing the upper wall of the case, a second surface facing the lower wall of the case, and a plurality of first connection pads in or on the first surface and electrically grounded;
• a plurality of first semiconductor chips on the first surface of the substrate in a first accommodation space;
• a plurality of second semiconductor chips on the first surface of the substrate in a second accommodation space;
• an external connector extending from an edge of the substrate and exposed to outside of the case through an opening of the case;
• and
• a first shielding structure including a plurality of first unit shielding structures surrounding the plurality of first semiconductor chips, wherein the plurality of first unit shielding structures are spaced apart from each other and define a plurality of gaps therebetween,
• wherein the first accommodation space and the second accommodation space communicate with each other through the plurality of gaps of the first shielding structure, and
• wherein each of the plurality of first unit shielding structures comprises:
• a conductor electrically connecting the upper wall of the case and to a corresponding first connection pad among the plurality of first connection pads;
• and
• an elastic body configured to provide a restoring force to the conductor.

A data storage apparatus comprising:

• a rack including a socket;
• a solid state drive (SSD) apparatus connected to the socket;
• and
• a cooling fan adjacent the rack and configured to force an air flow,
• wherein the SSD apparatus comprises:
• a case including an upper wall and a lower wall;
• a substrate in the case and including a plurality of first connection pads in or on a first surface of the substrate facing the upper wall of the case;
• a first semiconductor chip on the first surface of the substrate;
• and
• a first shielding structure electrically connecting the upper wall of the case to the plurality of first connection pads,
• wherein the first shielding structure comprises a plurality of first unit shielding structures surrounding the first semiconductor chip and spaced apart from each other with gaps therebetween, and
• wherein each of the plurality of first unit shielding structures comprises an elastic body.