Electronic device
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsHan-Chee YEN, Ying-Nan LIU, Min-Yao CHENG, Eelco BERGMAN
Life of this patent
Estimating the term…
Abstract
An electronic device is disclosed. The electronic device includes a first component, a second component, and a first bridge component configured to electrically connect the first component with the second component. The first component is configured to transmit a first signal downwardly without passing the first bridge component and the second component is configured to transmit/receive a second signal to/from outside of the electronic device. A transmission speed of the second signal is higher than a transmission speed of the first signal.
Claims20
An electronic device, comprising:
- a first component;
- a second component;
- and
- a first bridge component configured to electrically connect the first component with the second component,
- wherein the first component is configured to transmit a first signal downwardly without passing the first bridge component and the second component is configured to transmit/receive a second signal to/from outside of the electronic device, and wherein a transmission speed of the second signal is higher than a transmission speed of the first signal.
An electronic device, comprising:
- a first component;
- a second component;
- and
- a first bridge component configured to electrically connect the first component with the second component,
- wherein a first circuit region between the first component and the first bridge component has a first density and a second circuit region between the second component and the first bridge component has a second density lower than the first density.
An electronic device, comprising:
- an encapsulant;
- a first bridge component at least partially embedded in the encapsulant;
- a redistribution layer (RDL) disposed over the encapsulant;
- and
- a first electronic component disposed over the RDL,
- wherein the RDL is configured to provide a first signal path between the first electronic component and the first bridge component, and configured to provide a second signal path between the first bridge component and a component external to the electronic device without passing through the encapsulant.
Dependencies are inferred from the claim text.