Package structure and method of forming the same

A package structure, comprising:

• a thermal dissipation structure comprising a substrate;
• a lower encapsulant extending along a sidewall of the substrate;
• a die disposed on the substrate, the die comprising an active surface and a sensing region on the active surface;
• an upper encapsulant extending along a sidewall of the die, the upper encapsulant comprises a top surface and a bottom surface, the active surface of the die being between the top and bottom surfaces of the upper encapsulant;
• and
• a redistribution structure disposed on the top surface of the upper encapsulant and revealing the sensing region of the die, the redistribution structure being electrically coupled to the active surface of the die.

A package structure, comprising:

• a thermal dissipation structure comprising a substrate;
• a lower encapsulant covering a sidewall of the substrate;
• a die disposed on the substrate, the die comprising a sensing region and a contact pad disposed between a sidewall of the die and the sensing region;
• an upper encapsulant disposed on and partially covering the substrate, the upper encapsulant covering the sidewall of the die and being higher than the die relative to the substrate;
• and
• a redistribution structure disposed on the upper encapsulant and revealing the sensing region of the die, the redistribution structure comprising a first conductive via landing on the contact pad, the die being electrically coupled to the substrate through the redistribution structure.