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US 2024/0194581 A1Published application
Power module and manufacturing method therefor
AssigneeAmosense Co., Ltd.
InventorJihyung LEE
Life of this patent
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Abstract
The present invention relates to a power module and a manufacturing method therefor, the power module using a conductive spacer to electrically connect an electrode of a semiconductor chip and an electrode pattern of a ceramic substrate without a wire, thereby converting rated voltage and current while removing electrical risk elements, which can be generated during wire bonding, and increasing reliability and efficiency when used with high power.
Claims15
A power module comprising:
- a ceramic substrate on which an electrode pattern made of a metal is formed on at least one surface of a ceramic base material;
- a conductive spacer having a lower surface that is bonded onto the electrode pattern of the ceramic substrate;
- a semiconductor chip on which electrodes are bonded onto an upper surface of the conductive spacer;
- and
- a brazing filler layer configured to braze the electrode pattern of the ceramic substrate and the lower surface of the conductive spacer.
2 more elements
A method for manufacturing a power module comprising:
- preparing a ceramic substrate by forming an electrode pattern made of a metal on at least one surface of a ceramic base material;
- preparing a conductive spacer;
- brazing a lower surface of the conductive spacer onto the electrode pattern of the ceramic substrate;
- and
- bonding electrodes of a semiconductor chip onto an upper surface of the conductive spacer.
2 more elements
Dependencies are inferred from the claim text.