Capacitive coupling package structure
AssigneeLite-On Singapore Pte. Ltd.
InventorYOU-FA WANG
Life of this patent
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AssigneeLite-On Singapore Pte. Ltd.
InventorYOU-FA WANG
Estimating the term…
A capacitive coupling package structure includes a first lead frame, a second lead frame, a plurality of transmitter modules, a plurality of receiver modules, and a spacer. The second lead frame corresponds to and is aligned with the first lead frame, and a gap is defined between the first lead frame and the second lead frame. The transmitter modules are each disposed on a first surface of the first lead frame or a second surface of the second lead frame. The receiver modules are each disposed on the first surface of the first lead frame or the second surface of the second lead frame. First and second signal output plates of the transmitter module and first and second signal input plates of the receiver module are disposed respectively through a plurality of floating leads, and are spaced apart from each other by a predetermined distance.
A capacitive coupling package structure, comprising:
Dependencies are inferred from the claim text.