Land structure for semiconductor package and method therefor

A method of manufacturing a semiconductor package, comprising:

• providing a substrate comprising:
• a first land comprising:
• a first land section comprising a first part proximate to a first surface of the substrate and extending to a second part internal to the first land;
• and
• a second land section comprising a third part proximate to a second surface of the substrate and extending to the second part and comprising opposing first and second lateral ends;
• a second land comprising:
• a second land wide portion comprising opposing third and fourth lateral ends;
• and
• a second land narrow portion so that the second land is configured in a T-shape;
• and
• a first mold layer disposed adjacent to and directly contacting the first land section and the second land narrow portion, wherein:
• the first land section is at least partially exposed from the first mold layer outside of the semiconductor package;
• the first land section has a first height;
• the second land section has a second height;
• the first part of the first land section has a first width in a first cross-sectional view;
• and
• the third part of the second land section has a second width in the first cross-sectional view that is less than the first width;
• coupling a semiconductor device to the first land with a first conductive interconnect and coupled to the second land, the semiconductor device comprising a first major surface, a second major surface opposing the first major surface, and an outer perimeter;
• and
• providing a mold member encapsulating at least portions of the semiconductor device, wherein:
• the mold member comprises a bottom side, the first mold layer comprises a top side, the top side of the first mold layer adjoins the bottom side of the mold member at a location where the second land wide portion meets the second land narrow portion and the first land section meets the second land section;
• the first conductive interconnect is attached to the second land section at a location that is laterally spaced apart from the first land section in a second cross-sectional view;
• the location overlies the first mold layer in the second cross-sectional view;
• and
• the mold member and the first mold layer comprise separate layers and different materials.

A semiconductor package comprising:

• a substrate comprising:
• a first land having a first land section comprising a first part proximate to a first surface of the substrate and extending to a second part internal to the first land, the first land comprising a second land section comprising a third part proximate to a second surface of the substrate and extending to the second part;
• a second land having a second land wide portion and second land narrow portion;
• and
• a first mold layer disposed adjacent to and directly contacting the first land section and the second land narrow portion,
• wherein:
• the first land section has a first height;
• the second land section has a second height different than the first height;
• the first land section comprises a first width in a first cross-sectional view;
• and
• the second land section comprises a second width in the first cross-sectional view;
• a semiconductor device coupled to the second land section and coupled to the second land wide portion,
• wherein:
• at least a portion of the first land section is disposed outside a perimeter of the semiconductor device in a second cross-sectional view;
• the first land section comprises a first narrowest dimension in the first cross-sectional view parallel to the first width;
• the second land section comprises a second narrowest dimension in the first cross-sectional view parallel to the second width;
• and
• the first narrowest dimension is less than the second narrowest dimension;
• and
• a mold member encapsulating at least portions of the semiconductor device;
• wherein:
• the mold member comprises a bottom side;
• the first mold layer comprises a top side;
• and
• the top side of the first mold layer adjoins the bottom side of the mold member at location where the second land wide portion meets the second land narrow portion and the first land section meets the second land section.