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US 2024/0194571 A1Published application
Lead frame including lead with groove formed therein
AssigneeHaesung Ds Co., Ltd.
InventorsDo Yeon WOO, Seok Kyu SEO, Byoungchul CHOI
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Abstract
According to an aspect of the present disclosure, provided is a lead frame including a plurality of lead with a lead groove formed therein; and a dambar arranged between the leads to connect the leads, wherein a thickness of the dambar arranged between the leads has at least two thickness values, and a dambar groove is formed between a thickest portion of the dambar and the lead neighboring the thickest portion of the dambar.
Claims8
A lead frame comprising:
- a plurality of lead with a lead groove formed therein;
- and
- a dambar arranged between the leads to connect the leads,
- wherein a thickness of the dambar arranged between the leads has at least two thickness values, and
- a dambar groove is formed between a thickest portion of the dambar and the lead neighboring the thickest portion of the dambar.
2 more elements
Dependencies are inferred from the claim text.