Method of manufacturing semiconductor devices, corresponding substrate and semiconductor device
AssigneeSTMicroelectronics International N.V.
InventorMauro MAZZOLA
Life of this patent
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Abstract
A common electrically conductive substrate includes substrate portions configured to host semiconductor chips. Adjacent substrate portions have mutually facing sides with elongate sacrificial connecting bars extending between the mutually facing sides. The electrically conductive substrate is cut along a length of the elongate sacrificial connecting bars to provide singulated individual substrate portions. The elongate sacrificial connecting bars are provided with an apertured structure comprising apertures distributed along the length of the elongate sacrificial connecting bars wherein the apertures provide zones of reduced resistance to cutting.
Claims19
A method, comprising:
- providing a common electrically conductive substrate for a plurality of semiconductor devices, wherein the common electrically conductive substrate comprises a plurality of first substrate portions configured to host respective semiconductor chips, wherein adjacent first substrate portions in the common electrically conductive substrate have mutually facing sides with elongate sacrificial connecting bars extending between the mutually facing sides;
- providing the elongate sacrificial connecting bars with an apertured structure comprising apertures distributed along a length of the elongate sacrificial connecting bars;
- and
- cutting the common electrically conductive substrate along the length of the elongate sacrificial connecting bars to provide singulated individual substrate portions.
An electrically conductive substrate, comprising:
- a plurality of first substrate portions configured to host respective semiconductor chips;
- wherein adjacent first substrate portions in the electrically conductive substrate have mutually facing sides and have elongate sacrificial connecting bars extending between the mutually facing sides;
- and
- wherein the elongate sacrificial connecting bars have an apertured structure comprising apertures distributed along a length of the elongate sacrificial connecting bars.
A semiconductor device, comprising:
- an electrically conductive substrate including a substrate portion;
- a semiconductor chip mounted to the substrate portion;
- wherein the electrically conductive substrate further includes at least one tie bar projecting from a side of the substrate portion;
- wherein said at least one tie bar includes an aperture extending through the at least one tie bar at a distal end of the at least one tie bar;
- and
- a protective package of insulating molding material encapsulating the semiconductor chip, said protective package having a side edge;
- and
- wherein the distal end of the at least one tie bar and aperture are exposed at the side edge.
Dependencies are inferred from the claim text.