Package structure and method of forming the same

A package structure, comprising:

• a first redistribution layer (RDL) structure;
• a second RDL structure over the first RDL structure;
• a first die and a first encapsulant disposed between the first RDL structure and the second RDL structure;
• a first through via extending through the first encapsulant and connecting the first RDL structure and the second first RDL structure;
• and
• a first adhesion promoter layer and a first discontinuous oxide layer separating the first through via from the first encapsulant.

A method of forming a package structure, comprising:

• forming a first redistribution layer (RDL) structure;
• forming a first through via connecting the RDL structure;
• forming a first adhesion promoter layer and a first discontinuous oxide layer on sidewalls of the first through via;
• attaching a first die over the first RDL structure;
• forming a first encapsulant encapsulating the die, the first through via and the first adhesion promoter layer;
• and
• forming a second RDL structure over the first die, the first encapsulant, and the first through via over the first RDL structure, wherein the first die, the first through via and the first encapsulant are disposed between the first RDL structure and the second RDL structure;
• wherein the first through via extends through the first encapsulant and connects the first RDL structure and the second first RDL structure,
• wherein the first adhesion promoter layer and the first discontinuous oxide layer separate the first through via from the first encapsulant.