An electronic module including a semiconductor package disposed on an interposer layer
AssigneeInfineon Technologies Austria AG
InventorsEdward Fuergut, Davide Chiola, Martin Gruber, Wolfram Hable
Life of this patent
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Abstract
An electronic module includes a semiconductor package including a die carrier, a semiconductor transistor die disposed on the die carrier, an electrical conductor connected to the semiconductor die, and an encapsulant covering the die carrier, the semiconductor die, and the electrical conductor so that a portion of the electrical conductor extends to the outside of the encapsulant. The electronic module further includes an interposer layer on which the semiconductor package is disposed, and a heat sink through which a cooling medium can flow. The interposer layer is disposed on the heatsink.
Claims20
An electronic module, comprising:
- a semiconductor package comprising a die carrier, a semiconductor die disposed on the die carrier, an electrical conductor connected to the semiconductor die, and an encapsulant covering the die carrier, the semiconductor die, and the electrical conductor so that a portion of the electrical conductor extends to the outside of the encapsulant;
- an interposer layer, wherein the semiconductor package is disposed on the interposer layer;
- and
- a heat sink through which a cooling medium can flow, wherein the interposer layer is disposed on the heatsink,
- wherein the semiconductor package is soldered, diffusion soldered, or sintered onto the interposer layer, or connected to the interposer layer by a conductive glue or a silver conductive glue.
An electronic module, comprising:
- a semiconductor package comprising a die carrier, a semiconductor die disposed on the die carrier, an electrical conductor connected to the semiconductor die, and an encapsulant covering the die carrier, the semiconductor die, and the electrical conductor so that a portion of the electrical conductor extends to the outside of the encapsulant;
- an interposer layer, wherein the semiconductor package is disposed on the interposer layer;
- and
- a heat sink through which a cooling medium can flow, wherein the interposer layer is disposed on the heatsink,
- wherein the die carrier is thicker than the interposer layer.
An electronic module, comprising:
- a semiconductor package comprising a die carrier, a semiconductor die disposed on the die carrier, an electrical conductor connected to the semiconductor die, and an encapsulant covering the die carrier, the semiconductor die, and the electrical conductor so that a portion of the electrical conductor extends to the outside of the encapsulant;
- an interposer layer, wherein the semiconductor package is disposed on the interposer layer;
- and
- a heat sink through which a cooling medium can flow, wherein the interposer layer is disposed on the heatsink,
- wherein the semiconductor package is soldered, diffusion soldered, or sintered onto the interposer layer, or connected to the interposer layer by a conductive glue or a silver conductive glue,
- wherein the die carrier is thicker than the interposer layer.
Dependencies are inferred from the claim text.