Cooling system for a semiconductor device assembly
AssigneeMicron Technology, Inc.
InventorsRavi Kumar Kollipara, Suresh Reddy Yarragunta
Life of this patent
Estimating the term…
Abstract
A semiconductor device assembly is provided that includes a cooling system. The semiconductor device assembly includes a semiconductor die assembled onto a substrate. A channel is disposed at a back side of the semiconductor die to enable fluid to flow through the channel and cause heat to transfer from the semiconductor die to the fluid. The fluid is received through an inlet to enable the fluid to be flowed through the channel. After the fluid is flowed through the channel, the fluid is expelled through an outlet. In this way, a compact and effective cooling system for a semiconductor device assembly may be implemented.
Claims20
A semiconductor device assembly, comprising:
- a substrate;
- a semiconductor die assembled onto the substrate;
- a layer of dielectric material disposed on a back surface of the semiconductor die, the layer of dielectric material defining a channel configured to enable a fluid to flow through the channel and cause heat to be transferred from the semiconductor die to the fluid through the back surface of the semiconductor die, the layer of dielectric material including a plurality of structures extending through the channel effective to accelerate a flow of the fluid through the channel;
- an inlet configured to receive the fluid to be flowed through the channel;
- and
- an outlet configured to expel the fluid after it has been flowed through the channel.
A method of making a semiconductor device assembly, comprising:
- providing a semiconductor die coupled to a substrate;
- disposing a layer of dielectric material on a back surface of the semiconductor die;
- etching the layer of dielectric material effective to create a channel having a plurality of structures extending through the channel, the channel configured to enable a fluid to be flowed through the channel to transfer heat from the semiconductor die to the fluid through the back surface of the semiconductor die, the plurality of structures effective to accelerate a flow of the fluid through the channel;
- and
- enclosing the layer of dielectric material with a lid effective to create an inlet configured to receive the fluid to be flowed through the channel and an outlet configured to expel the fluid after it has been flowed through the channel.
A semiconductor device assembly, comprising:
- an input manifold configured to provide fluid to be flowed through a plurality of channels;
- an output manifold configured to expel the fluid after it has been flowed through the plurality of channels, the input manifold and the output manifold connected only through the plurality of channels;
- a processor die;
- a first channel of the plurality of channels, the first channel disposed at the processor die and configured to receive a first portion of the fluid from the input manifold and provide the first portion of the fluid to the output manifold after it has been flowed through the first channel;
- and
- a plurality of semiconductor die packages, each semiconductor die package including:
- at least one semiconductor die;
- and
- a second channel of the plurality of channels, the second channel disposed at the at least one semiconductor die and configured to receive a second portion of the fluid from the input manifold and provide the second portion of the fluid to the output manifold after it has been flowed through the second channel.
Dependencies are inferred from the claim text.