# US 2024/0194564 A1 · Fluidic-channel cooled substrates

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2024/0194564 A1
- Document ID: US20240194564A1
- Status: Published application
- Kind: A1
- Application number: 18/444,251
- Filed: 2024-02-16
- Published: 2024-06-13
- Earliest claimed: 2022-10-21
- Assignees: Semiconductor Components Industries, LLC
- Applicants: Semiconductor Components Industries, LLC
- Inventors: Jihwan KIM; Oseob JEON; Seungwon IM; Dongwook KANG
- Web page: https://patentgrep.com/patent/US20240194564A1

## CPC

- H10W 40/47: by flowing liquids, e.g. forced water cooling
- H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates}
- H10W 40/778: {in encapsulations}
- H10W 70/692: Ceramics or glasses
- H10W 74/114: {by a substrate and the encapsulations}
- H10W 76/138: having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
- H10W 90/00: Package configurations
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

In a general aspect, a semiconductor device module includes a ceramic substrate having a first surface and a second surface opposite the first surface, a patterned metal layer disposed on the first surface of the ceramic substrate, a semiconductor die disposed on the patterned metal layer, and a cooling structure disposed on the second surface of the ceramic substrate. The cooling structure includes a plurality of copper sheets defining a plurality of fluidic-cooling channels. At least one copper sheet of the plurality of copper sheets is at least one of coated or plated with a corrosion-resistant material. The module also includes a molding compound that encapsulates the ceramic substrate, the patterned metal layer and the semiconductor die. The molding compound also partially encapsulates the cooling structure, such that a fluidic interface surface of the cooling structure is exposed through the molding compound.

## Claims

### Claim 1

A semiconductor device module comprising:
a ceramic substrate having a first surface and a second surface opposite the first surface;
a patterned metal layer disposed on the first surface of the ceramic substrate;
a semiconductor die disposed on the patterned metal layer;
a cooling structure disposed on the second surface of the ceramic substrate, the cooling structure including a plurality of copper sheets defining a plurality of fluidic-cooling channels, at least one copper sheet of the plurality of copper sheets being at least one of coated or plated with a corrosion-resistant material; and
a molding compound that:
encapsulates the ceramic substrate, the patterned metal layer and the semiconductor die; and
partially encapsulates the cooling structure, such that a fluidic interface surface of the cooling structure is exposed through the molding compound.

### Claim 2 (depends on 1)

The semiconductor device module of claim 1, wherein the plurality of fluidic-cooling channels are configured to be in fluidic communication with a coolant distributor.

### Claim 3 (depends on 1)

The semiconductor device module of claim 1, wherein a fluidic-cooling channel of the plurality of fluidic-cooling channels has a width of greater than 1.0 millimeter.

### Claim 4 (depends on 1)

The semiconductor device module of claim 1, wherein a fluidic-cooling channel of the plurality of fluidic-cooling channels includes:
an inlet portion;
an outlet portion; and
a U-turn portion that fluidically couples the inlet portion with the outlet portion.

### Claim 5 (depends on 4)

The semiconductor device module of claim 4, wherein:
the inlet portion is arranged along a first axis and the outlet portion is arranged along a second axis, the first axis and the second axis being orthogonal to the second surface of the ceramic substrate; and
the U-turn portion is arranged along a third axis that is parallel to the second surface of the ceramic substrate.

### Claim 6 (depends on 4)

The semiconductor device module of claim 4, wherein:
the inlet portion and the outlet portion are defined by a first subset of the plurality of copper sheets; and
the U-turn portion is defined by a second subset of the plurality of copper sheets.

### Claim 7 (depends on 6)

The semiconductor device module of claim 6, wherein:
the fluidic-cooling channel is a first fluidic-cooling channel;
the first subset of the plurality of copper sheets further defines:
a barrier between the inlet portion and the outlet portion of the first fluidic-cooling channel; and
a first portion of a barrier between the inlet portion of the first fluidic-cooling channel and an inlet portion of a second fluidic-cooling channel; and
the second subset of the plurality of copper sheets further defines a second portion of the barrier between the inlet portion of the first fluidic-cooling channel and the inlet portion of the second fluidic-cooling channel.

### Claim 8 (depends on 7)

The semiconductor device module of claim 7, wherein the inlet portion of the first fluidic-cooling channel is adjacent to the inlet portion of the second fluidic-cooling channel.

### Claim 9 (depends on 7)

The semiconductor device module of claim 7, wherein:
the first subset of the plurality of copper sheets further defines a first portion of a barrier between the outlet portion of the first fluidic-cooling channel and an outlet portion of a second fluidic-cooling channel; and
the second subset of the plurality of copper sheets further defines a second portion of the barrier between the outlet portion of the first fluidic-cooling channel and the outlet portion of the second fluidic-cooling channel.

### Claim 10 (depends on 9)

The semiconductor device module of claim 9, wherein the outlet portion of the first fluidic-cooling channel is adjacent to the outlet portion of the second fluidic-cooling channel.

### Claim 11

An electronic device assembly comprising:
a molded semiconductor device module including:
a ceramic substrate having a first surface and a second surface opposite the first surface;
a patterned metal layer disposed on the first surface of the ceramic substrate;
a semiconductor die disposed on the patterned metal layer;
a cooling structure disposed on the second surface of the ceramic substrate, the cooling structure including a plurality of fluidic-cooling channels; and
a molding compound that:
encapsulates the ceramic substrate, the patterned metal layer and the semiconductor die; and
partially encapsulates the cooling structure, such that a fluidic interface surface of the cooling structure is exposed through the molding compound;
a coolant distributor coupled with the fluidic interface surface of the cooling structure; and
a fluidic-cooling jacket having:
a coolant inlet;
a first fluidic circuit configured to provide a first portion of a coolant flow received at the coolant inlet to the coolant distributor;
a second fluidic circuit configured such that a second portion of the coolant flow bypasses the coolant distributor; and
a coolant outlet configured to receive the first portion of the coolant flow and the second portion of the coolant flow for egress from the fluidic-cooling jacket.

### Claim 12 (depends on 11)

The electronic device assembly of claim 11, wherein:
the plurality of fluidic-cooling channels include respective inlet portions, respective outlet portions, and respective U-turn portions, the respective U-turn portions fluidically coupling the respective inlet portions with the respective outlet portions; and
the coolant distributor including:
at least one coolant-inlet channel configured to receive and provide the first portion of the coolant flow to the respective inlet portions; and
at least one coolant-outlet channel configured to receive the first portion of the coolant flow from the respective outlet portions.

### Claim 13 (depends on 12)

The electronic device assembly of claim 12, wherein:
a coolant-inlet channel of the at least one coolant-inlet channel includes a ramped portion having a first slope; and
a coolant-outlet channel of the at least one coolant-outlet channel includes a ramped portion having a second slope opposite the first slope.

### Claim 14 (depends on 12)

The electronic device assembly of claim 12, wherein:
a coolant-inlet channel of the at least one coolant-inlet channel includes a fluidic-ingress port that is disposed on a first side of the coolant distributor; and
a coolant-outlet channel of the at least one coolant-outlet channel includes a fluidic-egress port that is disposed on a second side of the coolant distributor opposite the first side.

### Claim 15 (depends on 11)

The electronic device assembly of claim 11, wherein the second fluidic circuit includes:
a first bypass channel disposed along a first sidewall of the coolant distributor, the first sidewall being orthogonal to the fluidic interface surface of the cooling structure; and
a second bypass channel disposed along a second sidewall of the coolant distributor, the second sidewall being opposite the first sidewall and orthogonal to the fluidic interface surface of the cooling structure.

### Claim 16 (depends on 15)

The electronic device assembly of claim 15, wherein the second fluidic circuit includes a bypass channel disposed on a bottom wall of the coolant distributor, the bottom wall being parallel to the fluidic interface surface of the cooling structure.

### Claim 17 (depends on 15)

The electronic device assembly of claim 15, wherein an interface between the fluidic interface surface of the cooling structure and the coolant distributor includes a sealing member.

### Claim 18 (depends on 15)

The electronic device assembly of claim 15, wherein an interface between the coolant distributor and the fluidic-cooling jacket includes a sealing member.

### Claim 19 (depends on 15)

The electronic device assembly of claim 15, wherein the cooling structure includes a plurality of copper sheets defining a plurality of fluidic-cooling channels, at least one copper sheet of the plurality of copper sheets being at least one of coated or plated with a corrosion-resistant material.

### Claim 20 (depends on 19)

The electronic device assembly of claim 19, wherein the corrosion-resistant material includes nickel.