Die package structure, method for fabricating same, and package system

A package system, comprising:

• a die package structure, the die package structure comprising:
• a package substrate comprising:
• a first surface a1 and a second surface a2 opposite the first surface a1 on the package substrate;
• a heat dissipation connection point disposed on the first surface a1;
• a heat conduction channel Q formed in the package substrate and extending to the heat dissipation connection point;
• and
• a first connection terminal, the first connection terminal being disposed on the second surface a2 for connecting to an external device;
• a die coupled to the package substrate, the die comprising a hotspot R, the heat conduction channel Q of the package substrate extending between the hotspot R of the die and the heat dissipation connection point of the package substrate;
• a first package body disposed on the first surface a1, the first package body comprising a heat conduction structure formed in the first package body, the heat conduction structure extending from the heat dissipation connection point to a first package body surface of the first package body;
• and
• a circuit board coupled to the die package structure by a first connection terminal;

A method for fabricating a die package structure, comprising:

• providing a package substrate comprising a first surface a1 and a second surface a2 opposite the first surface a1 on the package substrate, a heat dissipation connection point disposed on the first surface a1, a heat conduction channel Q formed in the package substrate and extending to the heat dissipation connection point, and a first connection terminal, the first connection terminal being disposed on the second surface a2 for connecting to an external device;
• providing a die coupled to the package substrate, the die comprising a hotspot R, the heat conduction channel Q of the package substrate extending between the hotspot R of the die and the heat dissipation connection point of the package substrate;
• forming, on the first surface a1 of the package substrate, a first package body, the first package body comprising a heat conduction structure formed in the first package body, the heat conduction structure extending from the heat dissipation connection point to a first package body surface of the first package body;
• and
• forming a first connection terminal on the second surface a2 of the package substrate.