Memory device and method of assembling same
AssigneeWestern Digital Technologies, Inc.
InventorsChee Seng Wong, Yoong Tatt Chin, Wei Chiat Teng
Life of this patent
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Abstract
Technology for a memory device having memory dies flip-chip bonded to one or more interposers that are mounted to a system board is disclosed. The memory device may be an SSD and the system board may be an M.2 board. A memory controller die may be bonded to one of the interposer boards. In one aspect, the memory controller die is flip-chip bonded to the interposer board. In one aspect, a heat sink is attached to a top surface of the flip-chip bonded controller die and to top surfaces of a group of the memory dies. Neither the memory dies nor the interposers are covered with a mold compound. Performance of the memory device is improved by, for example, lower inductance and improved heat dissipation.
Claims20
A memory device comprising:
- a system board having an interface configured to connect to a host;
- an interposer board directly mounted to the system board, wherein the interposer board comprises a plurality of conductance patterns, each conductance pattern including a cluster of contact pads;
- and
- a plurality of memory dies flip-chip bonded to the interposer board, wherein each memory die comprises memory cells, wherein each memory die comprises a cluster of bump pads on a face of the memory die, wherein for each particular memory die the cluster of bump pads of the particular memory die are electrically bonded to the cluster of contact pads of one of the conductance patterns of the interposer board.
A method for assembling a solid state drive (SSD), the method comprising:
- flip-chip bonding a first group of bare memory dies directly to a primary side of an interposer board;
- flip-chip bonding a second group of bare memory dies directly to a secondary side of the interposer board, wherein each memory die in the first group and the second group comprises non-volatile memory cells;
- and
- mounting the interposer board directly to a system board.
A solid state drive (SSD), the SSD comprising:
- a substrate means including substrate contact means for providing an electrical contact to the substrate means, the substrate means including means for transferring data between the SSD and a host;
- a plurality of interposer means directly mounted to the substrate means, wherein each of the interposer means comprises a first set of interposer-die contact means on a primary side of the interposer means and a second set of interposer-die contact means on a secondary side of the interposer means, wherein each of the interposer means comprises interposer-substrate contact means on the secondary side of the interposer means, wherein the interposer-substrate contact means are directly connected to the substrate contact means;
- and
- a plurality of memory dies each comprising non-volatile memory cells, wherein each memory die comprises die bond means on a face of the memory die, the plurality of memory dies comprising a first set of memory dies each having the face directly mounted to the primary side of one of the plurality of interposer means with the die bond means electrically bonded to a set of the first set of interposer-die contact means, the plurality of memory dies comprising a second set of memory dies each having the face directly mounted to the secondary side of one of the plurality of interposer means with the die bond means electrically bonded to a set of the second set of interposer-die contact means.
Dependencies are inferred from the claim text.