Heatsink pedestals for thermal interface material fill

A heat sink comprising:

• a heat dissipating body;
• and
• a pedestal in direct contact with the heat dissipating body, the pedestal including an interface surface having an apex with a flat plateau geometry and a sidewall geometry that defines a truncated pyramid.

A method for mounting a heat sink to an electrical component comprising:

• applying a thermal interface material on at least one of a surface of one of the electrical component and the heat sink, wherein the heat sink includes a heat pedestal including an interface surface with an apex;
• and
• contacting the heat sink to the electrical component through the thermal interface material, wherein the apex of the interface surface is an element of the heat sink closest to the electrical component, wherein the interface surface including the apex cause the thermal interface material to flow during the contacting so that any space between the heat sink and the electrical component is filled with thermal interface material and is substantially free of voids.