Power module

A power module, comprising:

• a substrate, comprising a first metal surface;
• a plurality of semiconductor devices, disposed on the first metal surface;
• a plurality of pins, wherein an extending direction of each of the plurality of pins is perpendicular to a bottom side of the first metal surface;
• and
• an encapsulation material, wherein the encapsulation material is configured to seal the first metal surface and the plurality of semiconductor devices and to seal each pin partially, and each of the plurality of pins extends out of the encapsulation material along an identical direction,
• wherein the plurality of pins comprise a positive voltage pin and a negative voltage pin, an end of the positive voltage pin is attached to a middle position of a first side of the first metal surface, an end of the negative voltage pin is attached to a middle position of a second side of the first metal surface, wherein the first side and the second side are spatially opposite to each other, and the first side and the second side are connected to the bottom side of the first metal surface.