Semiconductor device and method of manufacturing the same
AssigneeMitsubishi Electric Corporation
InventorAkitoshi SHIRAO
Life of this patent
Estimating the term…
Abstract
Provided is a method of manufacturing a semiconductor device capable of increasing reliability. A method of manufacturing a semiconductor device includes steps of: filling a cavity and at least a part of a sealing material storage part with a sealing material by injecting the sealing material from a first gate of a mold, the mold including the cavity in which an electrical circuit is disposed, the first gate and a second gate provided to the cavity, and the sealing material storage part provided to an outer side of the cavity to be connected to the second gate; and making the sealing material filling the sealing material storage part flow back to the cavity via the second gate.
Claims10
A method of manufacturing a semiconductor device in which an electrical circuit including a semiconductor chip and a plurality of metal wires electrically connected to the semiconductor chip is sealed with a sealing material, comprising steps of:
- filling a cavity and at least a part of a sealing material storage part with the sealing material by injecting the sealing material from a first gate of a mold, the mold including the cavity in which the electrical circuit is disposed, the first gate and a second gate provided to the cavity, and the sealing material storage part provided to an outer side of the cavity to be connected to the second gate;
- and
- making the sealing material filling the sealing material storage part flow back to the cavity via the second gate.
A method of manufacturing a semiconductor device in which an electrical circuit including a semiconductor chip and a plurality of metal wires electrically connected to the semiconductor chip is sealed with a plurality of sealing materials, comprising steps of:
- filling a cavity and a part of a sealing material storage part with a first sealing material by injecting the first sealing material from a first gate of a mold, the mold including the cavity in which the electrical circuit is disposed, the first gate and a second gate provided to the cavity, and the sealing material storage part provided to an outer side of the cavity to be connected to the second gate;
- and
- making the second sealing material filling the sealing material storage part and having characteristics different from the first sealing material and the first sealing material injected from the first gate to fill the sealing material storage part flow back to the cavity via the second gate.
A semiconductor device, comprising:
- an electrical circuit including a semiconductor chip and a plurality of metal wires electrically connected to the semiconductor chip;
- and
- a sealing material sealing the electrical circuit, wherein
- at least one metal wire in the plurality of metal wires includes two or more curved parts in an elongated shape in a plan view.
Dependencies are inferred from the claim text.