Substrates for semiconductor packages

A packaged electronic device comprising:

• a first set of one or more dies;
• a second set of one or more additional dies;
• a package substrate on which the one or more dies and the one or more additional dies are supported, the package substrate including:
• a first section on which the one or more dies are supported, the first section having a first top surface and a bottom surface with one or more layers of material between the first top surface and the bottom surface;
• a second section on which the one or more additional dies are supported, the second section having a second top surface and the bottom surface of the first section with the one or more layers of material of the first section extending horizontally from the first section and structured between the second top surface and the bottom surface, the second section having one or more additional layers of material between the second top surface and the one or more layers of material of the first section extending horizontally from the first section, the second top surface at a level above the first top surface relative to the bottom surface;
• and
• contacts to the bottom surface to electrically communicate with one or more devices external to the packaged electronic device.

A system comprising:

• one or more processors;
• routing circuitry;
• one or more packaged electronic devices coupled to the one or more processors by the routing circuitry, at least one of the one or more packaged electronic devices including:
• a first set of one or more dies;
• a second set of one or more additional dies;
• a package substrate on which the one or more dies and the one or more additional dies are supported, the package substrate having:
• a first section on which the one or more dies are supported, the first section having a first top surface and a bottom surface with one or more layers of material between the first top surface and the bottom surface;
• a second section on which the one or more additional dies are supported, the second section having a second top surface and the bottom surface of the first section with the one or more layers of material of the first section extending horizontally from the first section and structured between the second top surface and the bottom surface, the second section having one or more additional layers of material between the second top surface and the one or more layers of material of the first section extending horizontally from the first section, the second top surface at a level above the first top surface relative to the bottom surface;
• and
• contacts to the bottom surface to couple to the routing circuitry.