Half bridge ceramic hermetic package structure

A multilevel ceramic body, comprising:

• opposite first and second sides;
• laterally opposite third and fourth sides spaced apart from one another along a first direction;
• laterally opposite fifth and sixth sides spaced apart from one another along a second direction that is orthogonal to the first direction;
• a first opening in the first side;
• a second opening in the first side, the second opening spaced apart from the first opening along the first direction;
• a third opening in the second side;
• and
• a ceramic separator structure extending along the second direction between the fifth and sixth sides and between the first and second openings.

A method of fabricating an electronic device, the method comprising:

• attaching a first plate to cover a first opening in a first side of a multilevel ceramic body;
• attaching a second plate to cover a second opening in the first side of the multilevel ceramic body;
• attaching leads to respective conductive pads on a second side of the ceramic body;
• attaching a first semiconductor die in a first interior portion of the ceramic body above the first plate;
• attaching a second semiconductor die in a second interior portion of the ceramic body above the second plate;
• electrically connecting a first component of the first semiconductor die and a second component of the second semiconductor die in a circuit;
• and
• attaching a third plate to cover a third opening in the second side of the multilevel ceramic body.