Metal based hydrogen barrier
AssigneeApplied Materials, Inc.
InventorsSrinivas Gandikota, Steven C.H. Hung, Srinivas D. Nemani, Yixiong Yang, Susmit Singha Roy, Nikolaos Bekiaris
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AssigneeApplied Materials, Inc.
InventorsSrinivas Gandikota, Steven C.H. Hung, Srinivas D. Nemani, Yixiong Yang, Susmit Singha Roy, Nikolaos Bekiaris
Estimating the term…
A method of forming an electronic device is disclosed. The method comprises forming depositing a metal on a substrate, the metal comprising one or more of copper (Cu), titanium (Ti), or tantalum (Ta). A metal cap is deposited on the metal. The metal cap comprises one or more of molybdenum (Mo), ruthenium (Ru), iridium (Ir), rhodium (Rh), palladium (Pd), silver (Ag), osmium (Os), platinum (Pt), or gold (Au). The substrate is then exposed to an anneal process, e.g., a hydrogen high-pressure anneal. The formation of the metal cap on the metal minimizes parasitic adsorption of hydrogen by the underlying metal.
A processing tool comprising:
A non-transitory computer readable medium including instructions, that, when executed by a controller of a processing tool, causes the processing tool to perform operations of:
Dependencies are inferred from the claim text.