Wafer handling device and sucker module thereof

Abstract

A wafer handling device is configured to transport a wafer tray. The wafer handling device includes a sucker module and a transporting apparatus. The sucker module includes a sucker body, at least one airtight assembly, and a pump. The sucker body includes a first portion and a second portion. The first portion has a hole and a first air sucking hole. The second portion has a second air sucking hole. The airtight assembly is connected to the hole. The pump has a suction tube connected to the first air sucking hole and the second air sucking hole. The transporting apparatus is configured to move the sucker body. When the sucker body is connected to the wafer tray, the first portion, the second portion, and the wafer tray form an airtight space.

Dependencies are inferred from the claim text.