Wafer processing apparatus

A processing apparatus for processing a wafer including in a face side thereof a device region containing a plurality of devices therein and an outer circumferential excessive region including a beveled portion on an outer circumferential end portion thereof, the processing apparatus comprising:

• a chuck table for holding the wafer thereon;
• a grinding unit for grinding the wafer held on the chuck table;
• a cleaning unit for cleaning the wafer;
• and
• a processing unit for performing a process of removing the beveled portion of the outer circumferential end portion of the wafer before the grinding unit grinds the wafer,
• wherein the processing unit includes a support for supporting the wafer with a surface thereof being exposed and a laser beam applying unit for emitting a laser beam having a wavelength transmittable through the wafer, and
• the laser beam applying unit applies the laser beam to the wafer supported on the support, from the exposed surface, while positioning a focused spot thereof within the outer circumferential excessive region of the wafer, to form a modified layer in the wafer along which to remove the beveled portion from the wafer.