Cleaning apparatus and polishing apparatus

A polishing apparatus comprising:

• a cleaning unit that cleans a wafer after polishing, wherein
• the cleaning unit includes:
• a cleaning tank that defines a cleaning space for cleaning a wafer;
• a wafer rotation mechanism that is arranged inside the cleaning tank and holds and rotates the wafer;
• a cleaning member that contacts and cleans a surface of the wafer, and is rotatable around a central axis extending in a lateral direction;
• a swing mechanism that swings the cleaning member around a swing axis located inside the cleaning tank to move the cleaning member from a retracted position outside of the wafer to a cleaning position directly above the wafer;
• a holder that holds the cleaning member;
• and
• a raising and lowering mechanism that raises and lowers the cleaning member, wherein
• a length of the cleaning member is longer than a radius of the wafer,
• a distance from a center of the cleaning member to the swing axis is smaller than a diameter of the wafer,
• when the swing mechanism swings the cleaning member around the swing axis, the cleaning member passes directly above a center of the wafer,
• the raising and lowering mechanism has:
• a pillar part that longitudinally extends;
• and
• an arm part that extends laterally from the pillar part, and
• a lower surface of the arm part is positioned above an upper surface of the holder.