Substrate processing apparatus and substrate processing method
AssigneeTokyo Electron Limited
InventorsShota UMEZAKI, Mikio NAKASHIMA, Takahiro HAYASHIDA
Life of this patent
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Abstract
A substrate processing apparatus includes: a processing container in which a substrate is accommodated; a holder configured to hold the substrate in a horizontal posture at a holding position inside the processing container; and a fluid supplier configured to supply, into the processing container, a supercritical processing fluid for drying the substrate to which a liquid adheres, wherein the fluid supplier includes a first direction change member configured to change a flow of the supercritical processing fluid, supplied radially outward from the substrate held by the holder, in a direction that does not come in contact with a radial outer end of the substrate.
Claims20
A substrate processing apparatus, comprising:
- a processing container in which the substrate is accommodated;
- a holder configured to hold the substrate in a horizontal posture at a holding position inside the processing container;
- and
- a fluid supplier configured to supply, into the processing container, a supercritical processing fluid for drying the substrate to which a liquid adheres,
- wherein the fluid supplier includes a first direction change member configured to change a flow of the supercritical processing fluid which is supplied radially outward from the substrate held by the holder, in a direction that does not come in contact with a radial outer end of the substrate.
A substrate processing method used in a substrate processing apparatus,
- wherein the substrate processing apparatus includes:
- a processing container in which a substrate is accommodated;
- a holder configured to hold the substrate in a horizontal posture at a holding position inside the processing container;
- and
- a fluid supplier configured to supply, into the processing container, a supercritical processing fluid for drying the substrate to which a liquid adheres, and including a first direction change member configured to change a flow of the supercritical processing fluid, supplied radially outward from the substrate held by the holder, in a direction that does not come in contact with a radial outer end of the substrate,
- the substrate processing method comprises:
- discharging the supercritical processing fluid from the fluid supplier into the processing container when increasing a pressure in an interior of the processing container.
Dependencies are inferred from the claim text.