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US 2024/0194388 A1Published application
Composite inductor
AssigneeChilisin Electronics Corp.
InventorsCHAU-CHYUN CHUNG, CHI-FENG LI, HSIN HSIEN YEH
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Abstract
A composite inductor includes a coil structure and a magnetic packaging structure. The coil structure has a through hole, and the coil structure is embedded in the magnetic packaging structure. The magnetic packaging structure contains at least a first magnetic body and a second magnetic body. Based on a total thickness of the magnetic packaging structure being 100%, a thickness of each of the first magnetic body and the second magnetic body is higher than or equal to 16%.
Claims29
A composite inductor, comprising:
- a coil structure having a through hole;
- and
- a magnetic packaging structure containing at least a first magnetic body and a second magnetic body;
- wherein the coil structure is embedded in the magnetic packaging structure, and based on a total thickness of the magnetic packaging structure being 100%, a thickness of each of the first magnetic body and the second magnetic body is greater than or equal to 16%.
1 more element
Dependencies are inferred from the claim text.