Thermal conduction based batch testing system

An apparatus, comprising:

• a housing comprising:
• a first thermal plate coupled with a thermal regulation system;
• a second thermal plate;
• and
• a test board, wherein the housing is configured to:
• receive a cartridge selectively coupled with a plurality of memory devices within a region disposed between the second thermal plate and the test board;
• and
• move the test board to be electrically coupled with the cartridge and the plurality of memory devices to be thermally coupled with the second thermal plate.

A method, comprising:

• inserting a cartridge comprising a plurality of memory devices into a region of a housing, the housing comprising a first thermal plate coupled with a thermal regulation system and a second thermal plate;
• reducing a pressure within the housing to move a test board to electrically couple with the cartridge and to apply a force to the cartridge to move the plurality of memory devices to thermally couple with the second thermal plate;
• and
• performing one or more functional tests of the plurality of memory devices using the test board based at least in part on reducing the pressure.