System for Detecting Defect and Computer-Readable Medium
AssigneeHitachi High-Tech Corporation
InventorHiroshi FUKUDA
Life of this patent
Estimating the term…
Abstract
The purpose of this disclosure is to generate a reference image on the basis of a proper model even for a sample such as a semiconductor device including many patterns and to perform a defect inspection using the reference image. This disclosure proposes one or more computer systems for identifying defects in a received input image. The one or more computer systems include a training device including an autoencoder that has been trained beforehand by inputting multiple images at different positions in a training image. The one or more computer systems divide the input image into multiple input images, input same to the autoencoder, and compare images output from the autoencoder with the input images.
Claims15
A system configured to detect defects on a semiconductor wafer, wherein the system is provided with one or more computer systems specifying the defects included in a received input image, the one or more computer systems are provided with a training device including an autoencoder trained in advance by inputting a plurality of images at different locations included in a training image, and one or more computer systems divide the input image, input the divided input images to the autoencoder, and compare an output image output from the autoencoder with the input image.
A non-transitory computer-readable medium storing program instructions executable on a computer system to perform a computer-implemented method of detecting defects on a semiconductor wafer, wherein the computer-implemented method is provided with a training device including an autoencoder trained in advance by inputting a plurality of images at different locations included in a training image, and the one or more computer systems divide the input image, input the divided input image to the autoencoder, and compare an output image output from the autoencoder with the input image.
A system for processing image signals obtained based on irradiation of a semiconductor wafer with a beam, wherein the system includes one or more computer systems computing difference information between first image data and second image data, and the one or more computer systems are configured to calculate a frequency for each degree of difference between the first image data and the second image data.
Dependencies are inferred from the claim text.