Method for modeling measurement data over a substrate area and associated apparatuses

A method for determining a process correction for at least a first process of a lithographic process, said lithographic process comprising at least the first process performed on at least a first substrate using at least a first apparatus and a second process performed on at least said first substrate using at least a second apparatus, where a correction actuation capability of the first apparatus differs from the second apparatus, the method comprising:

• obtaining metrology data relating to said first substrate;
• modeling said metrology data using a first model, said first model being related to said first apparatus;
• and
• controlling said first process based on the modeled metrology data;
• wherein said modeling and/or an additional processing comprises distributing a penalty in a performance parameter across said first process and said second process such that the distributed penalties in the performance parameter for said first process and said second process are within their respective specifications of the performance parameter.